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Choose SF100-A for FPCB-PCB lamination

In the wave of miniaturization and flexibility of electronic devices, the bonding of FPCB (Flexible Printed Circuit Board) and PCB (Printed Circuit Board) has always faced two major challenges: it must be bonded firmly to resist deformation, and at the same time, it can efficiently conduct heat from components. Sheen's SF100-A thermal pad is specially designed to solve this pain point, and has become a new choice in the industry with its unique performance.

Why Can SF100-A Meet Both Bonding and Heat Dissipation Requirements?

The core advantage of SF100-A lies in its balanced performance parameters: the thermal conductivity is above 0.8W/MK, ensuring that heat is quickly conducted from the heating elements of FPCB to the heat dissipation layer of PCB; while the elongation rate of 60%, the tensile strength and tear strength of 3-7MPa endow it with excellent toughness and resilience. When FPCB bends or folds due to the operation of the device, SF100-A can stretch with the deformation without breaking, firmly adhering to the contact surface, avoiding heat dissipation failure caused by gaps.

What's more critical is that SF100-A can actively expel air at the contact interface during the bonding process. Traditional bonding materials often form thermal resistance due to residual bubbles, but SF100-A can fully fill the tiny uneven surface between FPCB and PCB under pressure, forming a gap-free thermal conduction channel, allowing heat to be transferredwithout obstruction".

Can SF100-A Stay Stable in Extreme Environments?

The working environment of electronic devices is often complex and changeable, from cold outdoor equipment to high-temperature industrial chassis. SF100-A can easily cope with a wide operating temperature range of -40℃ to 200℃. In low-temperature environments, it will not lose viscosity due to embrittlement; in the face of high-temperature baking, its structure is stable and does not flow, and it always maintains a close combination with FPCB and PCB, ensuring that both bonding and heat dissipation performance are online under extreme working conditions.

Adapting to Various Scenarios, Can the Operation of SF100-A Be Simpler?

For different specifications of FPCB and PCB, SF100-A supports precise die-cutting processing: whether it is a narrow and long flat cable bonding area or a special-shaped contact surface with holes, it can be customized into a perfectly fitting shape. Operators do not need complex tools, just tear off the release film to quickly fit, which not only saves assembly time, but also ensures a higher yield rate.

From flexible circuits of smart wearable devices to high-density PCB components of automotive electronics, from lightweight design of consumer electronics to harsh environment applications of industrial control, SF100-A thermal pad has shown strong adaptability. With its comprehensive strength offirm bonding, fast heat dissipation, deformation resistance and easy operation", it not only solves many problems in the bonding process of FPCB and PCB, but also provides a solid guarantee for the stable operation and performance improvement of electronic devices. It is gradually redefining the bonding standard of FPCB and PCB and becoming an indispensable important material in the electronics manufacturing industry.