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Graphene thermal pads: AI data centers' savior

In today's era of rapid development in artificial intelligence technology, global data centers are facing unprecedented heat dissipation challenges. As the computing power of AI chips continues to soar, traditional heat dissipation solutions are increasingly struggling to meet the cooling needs of high-performance computing equipment. Against this backdrop,Sheen’s graphene thermal conductive pads with ultra-high thermal conductivity of 70W/(m·K) are emerging as a new favorite in the field of data center heat dissipation, and their excellent performance is rewriting the industry's technical standards.

The core heat dissipation problems faced by current AI data centers mainly focus on three aspects: Firstly, the sharp increase in chip heat flux density. Taking NVIDIA's newly released H100 GPU as an example, its thermal design power consumption has exceeded 700W, and the local heat flux density is even more than 100W/cm2. Secondly, the continuous improvement of server rack density has made the space left for the heat dissipation system increasingly limited. Finally, the energy consumption pressure is growing with each passing day. Under the background of carbon neutrality, how to reduce the energy consumption of the heat dissipation system has become a problem that every data center operator must face. These challenges are calling for a new generation of heat dissipation materials.

The advent of graphene thermal conductive pads perfectly responds to these industry pain points.It is a high-performance flexible thermal interface material. It utilizes the inherent superconducting thermal properties of graphene and is based on a two-dimensional structure composed of a single layer of carbon atoms.Through special preparation processes and composite technologies, it achieves an ultra-high thermal conductivity of 70W/(m·K). What does this value mean? It is equivalent to 5-40 times that of traditional silicone thermal conductive pads and even 2 times faster than the heat diffusion speed of metallic copper. In practical applications, servers using this material can be observed to have a significant reduction in chip junction temperature by 15-30℃, which is of great significance for improving chip performance and extending equipment life.

In addition to its excellent thermal conductivity, graphene thermal conductive pads also perform remarkable in terms of mechanical properties. After rigorous testing, even under a compression rate of 30%, its rebound rate can still remain above 90%. This means that during long-term use, the material can always maintain close contact with the chip and heat sink, avoiding poor contact caused by thermal expansion or mechanical vibration. What's more impressive is that after 100,000 thermal cycle tests, its performance attenuation can still be controlled within 5%, and this stability is far beyond industry standards.

From the perspective of practical application, the advantages of graphene thermal conductive pads are more obvious. In a practical case of a supercomputing center, after replacing traditional heat dissipation materials with 0.5mm thick graphene thermal conductive pads, the maximum operating temperature of the NVIDIA A100 GPU was reduced by 28℃. This not only significantly improved computing stability but also enabled the speed of the cooling fan to be reduced by 40%, and the overall energy consumption decreased by 15%. Similar successful cases are also reflected in 5G edge computing nodes. By using 0.3mm ultra-thin graphene pads, the device volume was successfully reduced by 30%, while the mean time between failures was increased to 100,000 hours.

Looking forward to the future, the development prospect of graphene thermal conductive materials is even more promising. Industry experts predict that the next generation of products will develop towards compounding and intellectualization. By compounding graphene with materials such as carbon nanotubes and boron nitride, its comprehensive performance can be further improved. The intelligent thermal conductive materials integrated with temperature sensing functions are expected to realize real-time monitoring and dynamic adjustment of the heat dissipation system. In addition, exclusive heat dissipation solutions for different chip architectures, as well as recyclable and degradable environmentally friendly thermal conductive materials, will all become the focus of future research and development.

For data center operators and server manufacturers, now is the best time to upgrade heat dissipation solutions. Adopting graphene thermal conductive pads can not only immediately solve current heat dissipation problems but also reserve sufficient space for future computing power upgrades.Therefore,  Sheen sincerely invite partners from various industries to come for cooperation to jointly promote the innovation of data center heat dissipation technology. Whether it is sample testing, scheme design, or technical support, we can provide professional services. Let us work together to embrace the new era of data center heat dissipation in the AI era.